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2026-05-29
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[보도자료] Innometry–Laserssel Sign MOU for Joint Development of CPO Inspection Equipment for AI Photonic Semiconductors
 

Convergence of X-ray/CT Non-Destructive Testing and Area Laser Technologies… Leading the Standard for Next-Generation Optical Communication Semiconductor Packaging

 Innometry Co., Ltd. (CEO Lee Gap-su), a specialist in X-ray/CT non-destructive testing equipment for advanced industries, announced on the 28th that it has signed a Memorandum of Understanding (MOU) with Laserssel Co., Ltd. (CEO Ahn Gun-jun), a specialist in laser equipment for semiconductor back-end processes, for the joint development of non-destructive inspection equipment for key components in the AI semiconductor and optical communications sectors.

 The agreement aims to jointly develop non-destructive testing equipment to ensure manufacturing reliability for advanced packaging components — including CPO (Co-Packaged Optics), glass substrates (TGV), HBM, and FC-BGA — which are emerging as core technologies in next-generation AI semiconductor packaging. CPO integrates optical and electrical signals into a single package, dramatically improving power efficiency and transmission speed in AI data centers, with precision bonding of internal optical elements cited as a key challenge for commercialization.

 Through this collaboration, the two companies plan to combine Innometry′s ultra-precision inspection technology with Laserssel′s advanced packaging process technology to develop X-ray/CT non-destructive inspection solutions specialized for next-generation advanced packaging components, including CPO modules, glass substrates (TGV), and HBM. The goal is to advance the solution in stages, from initial sample inspection through to mass production inline environments.

 Innometry develops and supplies inspection equipment specialized for NCM, LFP, all-solid-state, 46Φ, and ESS battery types to domestic battery manufacturers — including Korea′s top three battery companies — as well as global cell makers, leveraging its world-class X-ray/CT non-destructive testing technology and AI-based defect detection algorithms in the secondary battery sector. The company has also been rapidly expanding into advanced industrial sectors such as glass substrates (TGV), HBM packages, and foldable phones, and is entering a phase of full-scale performance recovery this year.

 Innometry CEO Lee Gap-su stated: "In the advanced semiconductor packaging field, where countless microscopic components are densely integrated into a narrow space, our AI-based inspection solution that detects invisible micro-defects is an indispensable technology. By leveraging synergies with Laserssel′s process technology — proven at global foundries — we will work to deliver tangible results in improving CPO manufacturing reliability and securing an early foothold in the market."

 Meanwhile, Laserssel independently developed surface-source area laser technology and supplies key bonding equipment for semiconductor back-end processes, including LSR (Laser Reflow) and LCB (Laser Compression Bonder). The company was the first in the world to commercialize area laser equipment for advanced packaging. It supplies advanced packaging process bonding equipment to global foundry and OSAT (outsourced semiconductor assembly and test) customers, and its order momentum is accelerating alongside growing demand for HBM and advanced packaging.

 Laserssel CEO Ahn Gun-jun commented: "CPO is a next-generation core technology for overcoming the power limitations of AI data centers. Given its structural characteristics — where silicon and glass materials are simultaneously integrated — area laser bonding technology, which achieves both speed and precision through uniform unit laser irradiation, is the optimal bonding method. By combining our technology with Innometry′s non-destructive inspection solution, we believe we can lead the defect-free process standard for next-generation optical communication semiconductor packaging."







 
 
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