Innometry Selected for Phase 2 of Government Project on AI-Based TGV Inspection Technology

Innometry, a provider of X-ray/CT non-destructive inspection solutions, announced on the 16th that it has been selected as a Phase 2 performer for a government-funded R&D project to develop inspection technology for glass substrate TGV (Through Glass Via), a key next-generation semiconductor packaging technology.

The project, supported by the Ministry of Trade, Industry and Energy, is titled “Development of a Business Model for an AI Image Recognition-Based X-ray/CT Inspection System for Detecting Defects in Glass Substrate TGV.” It aims to develop an inspection system capable of precisely detecting micro defects that may occur during the glass substrate TGV process through non-destructive methods using AI-based image analysis and X-ray/CT technology.

Structured as a phased government R&D program consisting of Phase 1 (business model development) and Phase 2 (technology development), Innometry was initially selected for Phase 1 amid strong competition of approximately 40:1. Following several months of evaluation, the company has now advanced to Phase 2. The project will proceed with government support over the next three years.

Glass substrate TGV is gaining attention as a next-generation semiconductor packaging technology alongside the rapid expansion of AI semiconductors and high-performance computing (HPC). However, as the manufacturing process and industry value chain are still in their early stages, the importance of ultra-precise non-destructive inspection technologies is expected to increase to ensure process stability and yield improvement.

As a market leader in battery inspection equipment, Innometry has expanded its non-destructive inspection applications beyond secondary batteries into advanced industries such as glass substrate TGV, semiconductor HBM packaging, and foldable displays. Leveraging its accumulated expertise in high-precision X-ray inspection and AI-based image analysis software, the company has recently supplied inspection equipment to TGV-related companies including JWMT and Xtol. It is also actively discussing technical collaborations and equipment supply with various semiconductor materials and chemical companies, further expanding its presence in the next-generation semiconductor inspection market.

Shin Jin-woo, Head of Inspection Technology Center at Innometry, stated, “In the glass substrate TGV process, micro defects such as internal voids, underfill issues, and seed defects can occur. These defects often appear in diverse shapes and sizes and in irregular patterns, making accurate detection challenging.” He added, “By developing AI image recognition algorithms capable of precisely detecting such micro defects, it will be possible to identify defects at an early stage of the process, minimize downstream cost losses, and ultimately improve overall process yield.”